• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reject box of a semiconductor device tester and a testing method using the same. More specifically, the semiconductor devices are mutually dropped in a process in which the semiconductor devices fall vertically. The present invention relates to a collection box that prevents damage due to a collision and an inspection method using the same. For this purpose, a structure of a collection box including partitions forming partitions that are separated from each other in an internal space in which semiconductor devices are accommodated, and directly inspecting semiconductor devices stored separately from each other. The inspection method that can be re-inspected and re-inspected is disclosed, and through this structure and method it is possible to prevent damage caused by the collision of the semiconductor device to lower the defective rate of the product and to automatically re-inspect the semiconductor device determined as defective By greatly increasing the efficiency of the inspection process It may be bad.
    公开号:KR20000027694A
    申请号:KR1019980045686
    申请日:1998-10-29
    公开日:2000-05-15
    发明作者:이상명；정삼용；박봉석；김선길
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Reject box of semiconductor device tester and testing method using the same
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device tester and a test method using the same, and more particularly, to a reject box, which is a tool for collecting a poor semiconductor device as a result of electrical property test in a test device. In particular, the present invention relates to a collection box characterized by constituting a compartment corresponding to each semiconductor element through a partition and a method of inspecting a semiconductor element using the same.
    Semiconductor devices are fabricated through a semiconductor fabrication process (fabrication) to form an integrated circuit on the surface of the wafer into large divisions and a semiconductor assembly (assembly) for cutting the wafer on which the integrated circuit is formed and assembling into individual semiconductor elements.
    The semiconductor device fabricated as described above is checked for performance and characteristics of each semiconductor device through various inspections before being shipped to the end user. Most of these inspections are performed through an automated inspection apparatus.
    The semiconductor devices whose electrical properties are found to be poor as a result of the inspection are accommodated in separate collection boxes and retested, and when they are determined to be defective again, they are returned and discarded.
    1 is a perspective view showing a conventional collection box (10). Referring to Figure 1 will be described the structure of the collection box 10 of the conventional semiconductor device inspection device (not shown) as follows.
    The conventional collection box 10 is composed of a box-shaped body 12 in which an upper side is opened and an inner space 14 is formed so that semiconductor devices that are determined to be defective as a result of inspection are dropped vertically. In particular, the body 12 has a form in which the upper portion is wider than the lower portion so that the semiconductor element is easily dropped and accommodated therefrom. A collection bin of such a structure is placed at a point on a path on which a transport table (not shown) of the inspection apparatus moves, and the semiconductor element determined to be defective as a result of the inspection is collected.
    2 is a flowchart illustrating a conventional semiconductor device inspection method. Referring to Figure 2 describes the inspection method as follows.
    The conventional inspection method includes the step of supplying a semiconductor device to the inspection device (50), the step of transferring to the inspection unit through the conveying table (60), and the step of inspecting the electrical characteristics of the semiconductor device (70), poor inspection results Accommodating the semiconductor device in the collection box (80) and ejecting a good semiconductor device as a result of the inspection (90).
    In this case, the semiconductor devices collected in the collection unit are re-supplied to the semiconductor device inspection apparatus through a manual operation of an operator, and the semiconductor devices, which are determined to be defective as a result of the re-inspection performed after the above inspection process, are finally conveyed and discarded.
    Since the semiconductor devices collected by using the conventional collection box are a reference point in the collection box when they are dropped from the transport tray, another semiconductor device falls again on top of the dropped semiconductor device, and this process is repeated. The semiconductor devices may be damaged by impacting each other. In addition, damage generated in the process of inspecting the semiconductor device may accumulate together with poor electrical characteristics of the semiconductor device, thereby reducing the efficiency of the manufacturing process for mass-producing the semiconductor device.
    SUMMARY OF THE INVENTION An object of the present invention is to provide a collection box of a semiconductor device inspection apparatus capable of preventing collision between semiconductor devices collected by dropping vertically from a transport table.
    It is still another object of the present invention to provide a semiconductor device inspection method capable of automatically re-inspecting defective semiconductor devices using a collection box.
    1 is a perspective view showing a conventional collection bin,
    2 is a flowchart illustrating a conventional semiconductor device inspection method;
    3 is a perspective view of a collection bin according to an embodiment of the present invention,
    4 is a schematic view showing a semiconductor device inspection apparatus according to another embodiment of the present invention;
    5 is a flowchart illustrating a method of inspecting a semiconductor device according to still another embodiment of the present invention.
    Description of the main parts of the drawing
    10, 110: Reject box 12, 112: Body
    14, 114: internal space 116: partition
    118: compartment 120: transfer table
    122: semiconductor element 132: slide pack
    134: detector 136: handle
    140: supply unit 150: inspection unit
    160: discharge part 170: the outer wall of the inspection device
    172: passage 200: semiconductor device inspection device
    A: Range of movement of transport tray B: Range of movement of slide pack
    In order to achieve the above object, the present invention is included in a semiconductor device inspection apparatus for inspecting electrical characteristics of a semiconductor device, and has a box-shaped body in which an internal space in which poor semiconductor devices are dropped and accommodated as a result of inspection is formed. In the collection, characterized in that the upper portion of the body is open, the body provides a collection of semiconductor device inspection apparatus including a partition to form a compartment corresponding to the falling semiconductor device.
    In addition, in order to achieve another object of the present invention (a) a plurality of semiconductor elements are arranged and supplied; (b) transferring the semiconductor devices to the inspection unit through a transfer table; (c) the semiconductor devices are electrically inspected; (d) receiving the defective semiconductor elements as a collection result in a collection; And (e) discharging good semiconductor elements as a result of the inspection; wherein the collection of the step (d) includes a partition forming a compartment corresponding to each semiconductor element; re-inspecting the electrical characteristics after the semiconductor elements of the collection box (d-1) are transferred to the inspection unit through the transfer table between steps d) and (e); And (d-2) transferring the defective semiconductor devices as a result of the retesting.
    Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
    3 is a perspective view illustrating a collection bin according to an embodiment of the present invention, and FIG. 4 is a schematic view illustrating a part of a semiconductor device inspection apparatus according to another exemplary embodiment of the present invention. Referring to Figures 3 and 4 looks at the structure of the collection box and the semiconductor device inspection apparatus according to the present invention.
    The collection box 110 according to the present invention has a box shape in which an upper side thereof is opened so that the semiconductor elements 122 which are determined to be defective as a result of inspection are dropped vertically from the transfer table 120 and accommodated therein. The body 112 is composed of. In addition to the conventional collection box, the collection box 110 according to the present invention includes a partition 116 forming a compartment 118 so that each semiconductor element 122 falling vertically can be accommodated in the compartment 118 separated from each other. Characterized in that.
    The structure and operation principle of the semiconductor device inspection apparatus 200 in which the collection box 110 is used will be briefly described with reference to FIG. 4 as follows.
    The semiconductor device inspecting apparatus 200 may include a supply unit 140 to which semiconductor elements such as a module are supplied, an inspection unit 150 in which electrical characteristics of the semiconductor elements are inspected, and a poor semiconductor according to an electrical characteristic inspection result. A collection box 110 through which the devices are collected, a discharge section 160 through which the good semiconductor devices are discharged, and a conveyance table 120 having a range A moving along each of these parts and transferring the semiconductor devices.
    That is, the semiconductor devices 122 aligned and supplied by the supply unit 140 are transferred to the inspection unit 150 through the transfer table 120 to be inspected for electrical characteristics, and the semiconductor elements determined as defective as a result of the inspection are collected (110). ), And the semiconductor element which is judged satisfactory as a result of the inspection is transferred to the discharge unit 160.
    At this time, the collection box 110 is placed on the slide pack 132 driven through the passage 172 formed in the outer wall 170 of the device, it can be automatically entered and exited by the range (B) of the driven slide pack. In addition, the detector 134 is formed on one side of the collection box to check the location of the collection box, and the handle 136 may be formed on the other side of the collection box so that the worker can easily move the collection box.
    In order for the semiconductor devices to be divided and accommodated in each compartment of the collection box, the position of the semiconductor device is dropped by appropriately controlling the transport table, and the control program for controlling the movement of the transport platform is preferably modified.
    The partitions may be formed in an appropriate number and an appropriate size according to the size of the semiconductor device to be applied, and thus the number of semiconductor devices accommodated in the collection box is determined.
    In addition, the shape of the partition to be applied to the present invention can be freely formed under the condition that the semiconductor elements falling vertically from the transfer tray do not contact each other in the internal space in the collection box. That is, it is preferable to have a form of a pair of partitions in which the center of the partition is completely removed so as to easily handle each semiconductor element, or as shown in FIG. 3, in which the center portion of the partition is partially removed.
    5 is a flowchart sequentially illustrating a method for inspecting a semiconductor device, according to another embodiment of the present invention. Referring to Figure 5 describes the inspection method according to the invention as follows.
    The inspection method according to the present invention includes the steps of supplying the semiconductor elements are arranged and supplied to the supply unit of the inspection device (210), the step of transferring the semiconductor elements to the inspection unit through the conveying table (220), the electrical characteristics of each semiconductor element is inspected And a step (240) of receiving the defective semiconductor elements as a result of the test, and a step (250) of transferring the good semiconductor elements as a result of the inspection to the discharge unit (250).
    In addition, in the semiconductor device inspection method according to the present invention, the semiconductor devices accommodated in the collection unit are determined to be defective and are transferred back to the inspection unit through the transfer table (242), and the electrical characteristics of the re-transferred semiconductor devices are re-inspected. And the step 244 of the retesting, wherein the defective semiconductor devices are accommodated in another collection box and returned 246, and the retesting result of the good semiconductor devices being transferred to the discharger and discharged 250.
    That is, in view of the fact that the conventional collection box accommodates poor semiconductor devices without compartment division, the collection box according to the present invention has a feature that each semiconductor device can be directly transferred from the collection box to the inspection unit because the semiconductor devices are accommodated in each compartment.
    Due to such a process, in the conventional inspection method, the process of supplying the semiconductor devices of the collection box back to the supply unit after the inspection apparatus is stopped may be omitted, which may lead to an improvement in the work efficiency.
    The collection box and the inspection method using the same according to the present invention are characterized by a structure including a partition for classifying and accommodating a semiconductor device determined to be defective and a method of re-inspecting the semiconductor device by transferring it directly to an inspection unit from the received collection box. According to this feature, it is possible to prevent the damage of the semiconductor device caused by the collision between the devices in the process of receiving the semiconductor device in the collection, it is possible to automatically re-inspect the semiconductor device determined as the primary failure. In this way, it is possible to prevent damage caused by the collision of the semiconductor device to lower the defective rate of the product, and also to improve the efficiency of the work process by including a step of automatically re-inspecting the semiconductor device determined as the primary failure.
    权利要求:
    Claims (8)
    [1" claim-type="Currently amended] It is included in the semiconductor device inspection device for inspecting the electrical characteristics of the semiconductor device, and as a result of the inspection has a box-shaped body is formed to form an inner space for receiving the bad semiconductor devices vertically dropped and the upper portion of the body is open In the collection box characterized in that,
    And the body includes a partition forming a compartment corresponding to the falling semiconductor element.
    [2" claim-type="Currently amended] The semiconductor device inspecting apparatus of claim 1, wherein the semiconductor device inspecting apparatus includes a transporting table for transporting the semiconductor devices, and the transporting platform transports the semiconductor devices up, down, left, and right within a predetermined range. Collected.
    [3" claim-type="Currently amended] 3. The collection device of claim 2, wherein the collection box is disposed at a vertical lower portion of a point in which the transfer table carries the semiconductor device.
    [4" claim-type="Currently amended] 4. The collection device according to claim 3, wherein the semiconductor device inspection device includes an automatic transport means, and the collection box is placed on the automatic transport means and enters into and out of the semiconductor device inspection device.
    [5" claim-type="Currently amended] 5. The collection device of claim 4, wherein the automatic transport means is a slide pack.
    [6" claim-type="Currently amended] The collection device of claim 3, wherein the collection box comprises a detector capable of identifying a vertical lower portion of the one point.
    [7" claim-type="Currently amended] (a) supplying a plurality of semiconductor devices in alignment;
    (b) transferring the semiconductor devices to an inspection unit through a transfer table;
    (c) electrically inspecting the semiconductor devices;
    (d) receiving defective semiconductor elements as a result of the inspection; And
    (e) ejecting good semiconductor elements as a result of the inspection;
    In the semiconductor device inspection method comprising:
    The collection box of step (d) includes a partition forming a compartment corresponding to each semiconductor device, and thus, between step (d) and step (e).
    (d-1) re-inspecting electrical characteristics after the semiconductor elements of the collection box are transferred to the inspection unit through the transfer tray; And
    (d-2) transferring the defective semiconductor devices as a result of the retest;
    Semiconductor device inspection method further comprising.
    [8" claim-type="Currently amended] 8. The method according to claim 7, wherein the defective semiconductor devices of the step (d-2) are received and transported in another collection box different from the collection box of the step (d).
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-10-29|Application filed by 윤종용, 삼성전자 주식회사
    1998-10-29|Priority to KR1019980045686A
    2000-05-15|Publication of KR20000027694A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019980045686A|KR20000027694A|1998-10-29|1998-10-29|Reject box of semiconductor device tester and testing method|
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